네트워킹
High-Power 100 mW DFB Laser Diode Chips
Get 100 mW of uncooled output power and 300 mW of output power when cooled, to enable 100 Gbps and 200 Gbps per lane, respectively, for cutting-edge O-band transceivers.
These chips are available in four wavelength bands to match coarse division multiplexing (CWDM) wavelength requirements in uncooled DR4 and DR8 transceivers. They feature high reliability and are qualified according to GR-468 for use in non-hermetic packages.
High-Power 100mW Laser Diode Chips
Get these chips tested and Inspected on translucent tape with grip-ring Ø 150 mm. Future-proof technology that can support advanced silicon transceiver designs to 1.6T.
주요 기능
Designed for uncooled O-band CWDM4
Qualified according to GR-468 for use in non-hermetic packages
Excellent reliability
Top anode and backside cathode configuration
RoHS 준수
Available wavelengths - CWDM4 1270 nm to 1330 nm
관련 제품
주요 성공 사례
레이저 프레임워크, 지멘스의 디지털 팩토리에서 두각을 나타내다
Coherent 개발 지원과 Coherent FrameWork 소프트웨어를 통해 지멘스는 ID Link 제조 프로그램을 성공적으로 구현할 수 있었습니다.