고급 패키징 및 상호 연결
고성능 광학 장치, 레이저 및 복합 재료를 활용하여 다이싱, 패키징 및 테스트 공정에서 정확도와 처리량을 향상시킵니다.
- Enhance Stability Mitigate mechanical and thermal issues in systems by using advanced composites.
- Precision Processing Create smaller, more precise features and cuts for advanced packaging with high-performance lasers.
- Versatile Marking Mark semiconductors, polymers, ceramics, metals, and more with high-performance lasers.
Higher Throughput
From wafer dicing to final packaging and test, back-end processes for increasingly smaller chips demand higher speed, greater mechanical precision, and reduced cost. Coherent products help achieve these goals throughout the production line. Metal matrix composites deliver mechanical parts with improved flatness, stiffness, and thermal conductivity, plus lower weight. Lasers delicately perform a variety of drilling and cutting processes that cannot be accomplished mechanically, as well as numerous non-contact marking tasks.
시작해 봅시다
본인에 관한 정보를 제출해 주시면, 제품 전문가가 영업일 기준 2일 이내에 연락드리겠습니다.
